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Laser Soldering Equipment - List of Manufacturers, Suppliers, Companies and Products

Laser Soldering Equipment Product List

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Inline laser soldering device

Inline laser soldering device

Leave your welding and joining needs to us! Soldering equipment with customizable individual process conditions.

This product is an inline laser soldering device. It significantly shortens the cycle time by welding from the underside without the need for flipping. It enables laser soldering of DIP components directly connected to the SMT assembly line. Additionally, all major mechanical dimensions and auxiliary equipment (laser, solder wire feeder, dispenser, etc.) can be customized according to your requests and work size. 【Features】 ■ Enables laser soldering of DIP components directly connected to the SMT assembly line ■ Significantly shortens cycle time through welding from the underside without the need for flipping ■ Individual process conditions can be set ■ Supports local procurement overseas ■ All major mechanical dimensions and auxiliary equipment can be customized according to your requests and work size *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.

Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.

Reduce the consumable costs of soldering irons! Rework in tight spaces is also possible! Reduce deterioration management and replacement labor for soldering irons, as well as decrease quality control labor.

A semiconductor laser soldering system developed by a soldering iron manufacturer that intentionally denies its own products! Utilizing a high-output semiconductor diode laser as the heat source, it achieves quality improvement by non-contact localized heating of mounted components for soldering. ■ Laser used: Adopts single-wavelength and coherent (interferable) light The output area can be narrowed down to standard φ0.4 and φ0.6 (minimum 0.2mm), making it ideal for localized soldering. ■ Minimizes thermal impact on narrow-pitch component mounting and surrounding areas. ■ Compatible solders Uses "rosin-core solder," "solder paste," "solder balls," and other "solder preforms." ■ The laser light is locally irradiated onto the pad surface and solder for speedy bonding! ■ By adopting laser soldering methods, it reduces the constraints of automated equipment, enabling more stable bonding quality than manual work.

  • Soldering Equipment

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Area Laser Soldering Research Group

Area Laser Soldering Research Group

Research on Laser Soldering Methods

Introduction to Shinwa's Initiatives We are conducting joint research on laser soldering methods compatible with surface mount and through-hole mounting, in collaboration with Senju Metal Industry, Japan Unix, and Shinwa. We aim to establish the conditions for laser soldering for through-hole mounting, developing THD and SMD in parallel.

  • dispenser

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Laser soldering device

Laser soldering device

We propose automation of equipment tailored to your needs.

We would like to introduce the "Laser Soldering Equipment" handled by OMC Corporation. Compatible with various devices from Panasonic Production Engineering, including semiconductor infrared lasers of 10W/30W/75W and blue lasers of 10W/50W. We offer PC/PLC control, dedicated machines/inline machines, and support for solder wire feeding devices/cream solder dispensers from various manufacturers. We will build a system using the equipment of your choice according to your budget. 【Features】 ■ Easy operation for high-quality soldering ■ Suitable for fine processing (minimum spot diameter: 0.4mm, solder wire diameter: φ0.3mm) ■ Establishment of a Class 4 laser management area, ensuring comprehensive safety measures ■ Equipped with semiconductor lasers from Panasonic Production Engineering *For more details, please refer to the PDF document or feel free to contact us.

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Quspa SOALA

Quspa SOALA

Unifying coating and area laser soldering. Achieve space-saving and time-saving with this one machine!

**Features** ◆ Space-saving By consolidating two different processes into one, we have achieved a 30% reduction in space compared to the traditional two equipment setups. Inline integration becomes easier. ◆ Time-saving By adopting area lasers, simultaneous soldering can be performed on multiple pins. A cycle time of 0.7 seconds per pin for solder application is now possible. This achieves a 60% reduction in cycle time compared to wire soldering and spot lasers. ◆ Labor-saving Non-contact operation allows for implementation in narrow spaces where the soldering tip cannot reach, without putting stress on the circuit board or terminals. Maintenance such as cleaning or replacing the soldering tip is unnecessary, facilitating automation through continuous operation. ◆ Energy-saving Since no soldering tip is used, the cost of consumables is reduced. Additionally, compared to solder baths and reflow ovens, there is no need for constant heating, allowing for savings on electricity costs. ◆ Enhanced customization capability We cater to various needs such as product size, weight, flow direction, and appearance inspection.

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